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FTE
Bonding equipment
Optics, photonics & sensors
Engineering consulting
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Equipment subsystems
IC Design
Lithography & mask making equipment
Applications areas
Mechatronics & motion
Metrology, inspection & testing
Services
Design tools
Molding & sealing systems
Dicing equipment
Assembly & packaging services
Pure play foundry
Wafer stabilizing
Assembly materials
IP core design
DAO (discrete, analog, other)
Equipment testing systems
Etching & cleaning tools
Chip type
Advanced packaging equipment
Cleanrooms
Components
Micro-assembly (RF, Photonics)
Other raw materials
Raw materials
Repair & maintenance
Wafer inspection/defect review
Wafer materials
We design, develop and produce innovative products for OEM and ODM customers worldwide. Our design is your success!