Founded in 1987, Boschman is a family-owned company that provides advanced packaging solutions, specialized in the development and supply of advanced transfer molding and sintering systems. Besides the development and supply of advanced equipment solutions Boschman regularly join forces with the R&D departments of their customers to co-develop and research innovative packaging concepts. They consider themselves to be a niche player, focusing on well-defined high growth market segments for power modules,  MEMS and sensors for the automotive, industrial, mobile and medical markets. For advanced packaging they have technology leadership in Film Assisted Molding (encapsulation) and silver sintering technology (for die attach) supported by their patented Dynamic Insert Technology (DIT). Headquartered in Duiven (Netherlands), Boschman has also offices in Singapore and Suzhou (China).