Chip Integration Technology Center (CITC) is a non-profit joint innovation center that specializes in heterogeneous integration and advanced chip packaging technology. CITC is a place where companies, research and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. We offer access to innovation, infrastructure and education.

Organizing and executing innovation programs in the field of packaging and integration technology for chips. CITC’s current program lines:

• Thermal High-Performance Packaging

• RF Chip Packaging

• Digital Package Manufacturing

• Integrated Photonics Packaging